Paper-Woven Circuits: Fabrication Approach for Papercraft-based Electronic Devices

Kunihiro Kato, Kaori Ikematsu, Yuki Igarashi, Yoshihiro Kawahara

研究成果: Conference contribution査読

抄録

In this pictorial, we propose an approach to integrate electronics into a paper-woven craft. A paper-woven structure is formed by alternately and orthogonally weaving paper strips. The key idea is to add conductive layers to these strips by printing or transferring conductive materials. Our approach enables us to form the skeleton of an object and its wiring and sensor arrangement simultaneously. We explore the creative space of this approach, i.e., integrating functions such as sensing, display, and sound amplification into objects, for leveraging the paper-woven structure. We also outline the workflow of the approach, introduce a design support tool, and discuss example applications that combine the electronic-enabled functionality and woven structure.

本文言語English
ホスト出版物のタイトルTEI 2022 - Proceedings of the 16th International Conference on Tangible, Embedded, and Embodied Interaction
出版社Association for Computing Machinery
ISBN(電子版)9781450391474
DOI
出版ステータスPublished - 13 2月 2022
イベント16th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2022 - Virtual, Online, Korea, Republic of
継続期間: 13 2月 202216 2月 2022

出版物シリーズ

名前ACM International Conference Proceeding Series

Conference

Conference16th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2022
国/地域Korea, Republic of
CityVirtual, Online
Period13/02/2216/02/22

フィンガープリント

「Paper-Woven Circuits: Fabrication Approach for Papercraft-based Electronic Devices」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル