Evaluation of silicon substrates fabricated by seeding cast technique

T. Tachibana, T. Sameshima, T. Kojima, K. Arafune, K. Kakimoto, Y. Miyamura, H. Harada, T. Sekiguchi, Y. Ohshita, A. Ogura

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

We evaluated the properties of crystalline defects in silicon substrate, and clarified the origin of small-angle grain boundaries. In order to eliminate the effects of grain boundaries, the ingot was fabricated by unidirectional solidification technique with seed crystal. In single-crystalline region, σ3 twin boundaries and SiC precipitates were observed near the seed crystal. No obvious correlation between twin boundaries and precipitates was observed. These defects decreased once and the precipitations appeared again. The density of precipitates increased through the crystal growth procedure. These precipitates were consisted of Si, C, and N. After the precipitation density increased, the small-angle grain boundaries appeared and some precipitates were observed at the boundaries. We considered the precipitation consisted of light element impurities such as C and N was one of the major origins of the small-angle grain boundary generation.

元の言語English
ホスト出版物のタイトルDefects-Recognition, Imaging and Physics in Semiconductors XIV
出版者Trans Tech Publications Ltd
ページ133-136
ページ数4
ISBN(印刷物)9783037854426
DOI
出版物ステータスPublished - 1 1 2012
イベント14th International Conference on Defects-Recognition, Imaging and Physics in Semiconductors, DRIP-14 - Miyazaki, Japan
継続期間: 25 9 201129 9 2011

出版物シリーズ

名前Materials Science Forum
725
ISSN(印刷物)0255-5476

Conference

Conference14th International Conference on Defects-Recognition, Imaging and Physics in Semiconductors, DRIP-14
Japan
Miyazaki
期間25/09/1129/09/11

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    Tachibana, T., Sameshima, T., Kojima, T., Arafune, K., Kakimoto, K., Miyamura, Y., Harada, H., Sekiguchi, T., Ohshita, Y., & Ogura, A. (2012). Evaluation of silicon substrates fabricated by seeding cast technique. : Defects-Recognition, Imaging and Physics in Semiconductors XIV (pp. 133-136). (Materials Science Forum; 巻数 725). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.725.133