Paper-Woven Circuits: Fabrication Approach for Papercraft-based Electronic Devices

Kunihiro Kato, Kaori Ikematsu, Yuki Igarashi, Yoshihiro Kawahara

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this pictorial, we propose an approach to integrate electronics into a paper-woven craft. A paper-woven structure is formed by alternately and orthogonally weaving paper strips. The key idea is to add conductive layers to these strips by printing or transferring conductive materials. Our approach enables us to form the skeleton of an object and its wiring and sensor arrangement simultaneously. We explore the creative space of this approach, i.e., integrating functions such as sensing, display, and sound amplification into objects, for leveraging the paper-woven structure. We also outline the workflow of the approach, introduce a design support tool, and discuss example applications that combine the electronic-enabled functionality and woven structure.

Original languageEnglish
Title of host publicationTEI 2022 - Proceedings of the 16th International Conference on Tangible, Embedded, and Embodied Interaction
PublisherAssociation for Computing Machinery
ISBN (Electronic)9781450391474
DOIs
Publication statusPublished - 13 Feb 2022
Event16th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2022 - Virtual, Online, Korea, Republic of
Duration: 13 Feb 202216 Feb 2022

Publication series

NameACM International Conference Proceeding Series

Conference

Conference16th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2022
Country/TerritoryKorea, Republic of
CityVirtual, Online
Period13/02/2216/02/22

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