Evaluation of dynamic fracture toughness of a bonded bi-material interface subject to high-strain-rate shearing using digital image correlation

Tomohisa Kojima, Yuta Kimura, Shuichi Arikawa, Mitsuo Notomi

Research output: Contribution to journalArticlepeer-review

Abstract

The fracture toughness at the bi-material interface of layered test pieces is determined using digital image correlation (DIC) as part of dynamic shear tests. High-strain-rate shear tests are conducted on a three-layered bonded test piece comprising a central aluminum layer with PMMA resin layers. When the crack is sufficiently shorter than the bonding interface length, mode II fracture appears at the aluminum–PMMA interface; otherwise, mode I and mode II fractures appear. As the obtained stress intensity factor is consistent with the literature values, a reasonable interface fracture toughness can be evaluated using the DIC.

Original languageEnglish
Article number107391
JournalEngineering Fracture Mechanics
Volume241
DOIs
Publication statusPublished - Jan 2021

Keywords

  • Bi-materials
  • Digital image correlation
  • Dynamic fracture
  • Fracture toughness
  • Interface

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